Diamond grinding wheel is one of the most effective tools for grinding cemented carbide materials. At present, resin bond diamond grinding wheels are generally used for grinding cemented carbide. Glory Diamond Tools could offer diamond wheels for carbide grinding. 1A1 grinding wheel can be used for flute grinding of carbide material. During grinding process, the local heat generated by the sharp edge of the abrasive is above 400℃, which makes the bond become soften and affects the bonding strength between the abrasive and the bond. When about half of the abrasives have not fully exerted the grinding effect, they fall off from the grinding wheel, thus affecting the widespread use of this kind of tool. In order to solve this problem, we have explored a more advanced grinding method, namely wet grinding. The so-called wet grinding method means we use diamond grinding wheel with copper-based bonding agent and a cooling liquid for grinding. Grinding hard alloy by wet grinding, the grinding depth is increased from 0.02mm to 8mm, the service life of the grinding wheel is extended from three to six months to two to three years, which gives full play to the advantages of diamond grinding wheel for cemented carbide grinding.
The diamond grinding wheel is composed of a diamond layer, a transition layer and a matrix. The diamond layer is an effective chip layer that mixes the diamond abrasive with the bond to form a grinding wheel. The transition layer is free of diamond abrasives and its primary function is to firmly bond the diamond layer to the substrate to ensure complete use of the diamond layer. The base acts as a support for the diamond layer and the diamond wheel is mounted on the machine tool by a flange clamp. The base is generally made of steel or aluminum.
Copper-based bond have a long service life and strong bonding force, but it is easily blocked. The reason is that the gap between particles and the copper base gradually decrease and tend to be zero during the grinding process, so that the grinding heat increases and the copper base is thermally expanded. When the gap becomes small, grinding becomes difficult. However, if the coolant can be sufficiently added during the grinding process, the grinding temperature can be greatly reduced. In the range of the grinding depth, the copper-based bond will be pressed by the action of the cutting force, and the gap of 0.02-0.03 mm is always maintained during the grinding process. The gap is equivalent to the chip flute of the milling cutter, so that the hard alloy dust cut by the abrasive grains has enough space. The coolant continuously flushes the grinding wheel, so that the debris in the gap is thrown away by the centrifugal force of high-speed rotation at any time and the grinding process has been fundamentally improved. In addition, the copper-based bond has strong bonding force. Even if the grinding pressure is increased, the abrasive grains will not fall off, which greatly prolongs the service life of the grinding wheel.
For the installation of a new grinding wheel, we must note that the yaw amount of the grinding surface should be not more than 0.02 mm. If it is more than 0.02mm, the yaw amount must be trimmed so that the grinding effect of the diamond abrasive grains can be fully exerted.