The research on the grinding mechanism of precision diamond grinding wheel is mainly focused on the research of multi-grain grinding mechanism, the research on the surface formation of workpieces, and the research on the factors affecting ultra-precision grinding. Glory Diamond Tools could offer diamond grinding wheel like 6A2 grinding wheel, 11A2 diamond grinding wheel, etc.
When the precision diamond grinding wheel grinds the brittle material, the abrasive particles with random geometry participate in the grinding and the grinding process is random, so the grinding mechanism is complicated. The formation of the surface of the workpiece can be seen as the sum of the results of the grinding of the individual abrasive particles. However, scholars agree that the material removal methods of brittle materials can be divided into two types, namely brittle fracture and ductile grinding. Brittle fracture is caused by the extrusion of abrasive grains on the surface of the workpiece to form tiny central cracks and lateral cracks on the surface of the workpiece. The expansion of the side cracks makes the material broke and reach material removal. The chips formed by ductile grinding are similar to those formed by ground metal materials. The grinding process includes chip formation, ploughing (bumping), sliding (sliding and rubbing). The various grinding behaviors described above ultimately constitute the surface state of the workpiece. In addition, during the grinding process, the abrasive grains of the grinding wheel have random geometric shapes and sizes, and their contact pressure with the surface of the workpiece is different, which forms different cutting depths. As the depth of cut and the grinding force increase, crystal dislocations increase and expand toward the inside of the workpiece, resulting in stress concentration, micro cracks in the subsurface and subsurface damage will be caused. Some of the abrasive grains are relatively high on the surface of the grinding wheel and they are relatively sharp. When sufficient depth of cut is obtained, the chips can be formed. Since some of the abrasive grains are relatively high on the surface of the grinding wheel, they are relatively sharp, and when a sufficient depth of cut is obtained, the chips can be written. Some abrasive grains are not high enough on the surface of the grinding wheel and they are not sharp enough. So plough will be caused on the surface of the workpiece to form a furrow. Some abrasive particles have low protrusion height and sharpness on the surface of the grinding wheel, which can only produce scratches on the surface of the workpiece. Some abrasive particles distributed on the grinding wheel have small protruding height and no cutting edge. They can only squeeze the contour peaks on the surface of the workpiece to form plastic deformation.
During the grinding process, only a small portion of the abrasive particles are in contact with the surface of the workpiece. Among this small portion of the abrasive particles, only a portion of the abrasive particles can produce chips on the workpiece. Other abrasive particles produce ploughs or slips on the surface of the workpiece. Increasing the grinding wheel speed can reduce the damage on the surface of the silicon wafer. Laser sonar technology can be used to measure the depth of subsurface damage of silicon wafers. The surface damage of the silicon wafer can be divided into three regions. By studying the subsurface damage depth of the silicon wafer, it is found that the uppermost layer region of the silicon wafer is amorphous and there is no crystal particles. Crystalline silicon exists below the amorphous layer. The thickness of the amorphous layer is about 100 nm, and micro-cracks, polysilicon, and crystal dislocation slips exist under the processed surface of the silicon wafer.